Comparative analysis of advanced shielding techniques for crosstalk mitigation in multi-walled carbon nanotube TSVs
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Full Text |
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Author |
Tappeta Chinna Sanjeeva Rayudu and N. Merrin Prasanna
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e-ISSN |
1819-6608 |
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On Pages
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2067-2073
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Volume No. |
20
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Issue No. |
24
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Issue Date |
February 20, 2026
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DOI |
https://doi.org/10.59018/1225229
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Keywords |
crosstalk mitigation, MWCNT, PDP, SWCNT, TSVs.
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Abstract
This study introduces an innovative approach to minimise crosstalk interference, power consumption, Power Delay Product (PDP), and Energy Delay Product (EDP) in multi-walled carbon nanotube (MWCNT)-based through-silicon vias (TSVs) using polymer dielectric liners. The proposed TSV design integrates MWCNT bundles as conductive channels and employs low-k polymer liners, such as polyimide, polypropylene carbonate (PPC), and benzocyclobutene (BCB), as insulating dielectrics. An equivalent electrical circuit model is developed to analyse crosstalk behaviour in coupled TSVs driven by a ternary inverter. Simulation results obtained with the HSPICE tool demonstrate that BCB-based TSVs achieve significant performance improvements, up to 30.21% compared to single-walled carbon nanotube (SWCNT) TSVs, particularly at reduced TSV heights. Additionally, BCB-lined TSVs exhibit exceptional crosstalk suppression at wider TSV pitch values, offering approximately 40.03% enhancement in the 0.5–3 μm pitch range over SWCNT counterparts. The analysis also shows that BCB reduces crosstalk delay by 43.8% compared to conventional SiO₂ liners. Overall, the results confirm that polymer liners-particularly BCB-significantly enhance signal integrity, lower power loss, and boost overall performance, making them a highly effective and reliable alternative for next-generation 3D integrated circuit (3D-IC) technologies.
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