Effect of high-temperature aging on microstructure properties of Sn96.5%Ag3-Cu0.5% (SAC305) lead-free solder joints
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Full Text |
Pdf
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Author |
Wasan Ali Hussein, Ahmed Jadah Farhan and Russell Yousif Thamer
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e-ISSN |
1819-6608 |
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On Pages
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1058-1062
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Volume No. |
18
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Issue No. |
09
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Issue Date |
June 30, 2023
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DOI |
https://doi.org/10.59018/0523138
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Keywords |
solder joints, SAC305, Isothermal aging, Ag3Sn.
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Abstract
The use of Sn96.5%Ag3%Cu0.5% (SAC305) as lead-free solder is increasing rapidly as an interconnection for electronic devices. Electronic devices face harsh environmental applications during the operation which can reach temperatures of 200 °C and expose soldiers. The microstructure properties of lead-free solders are highly dependent on the process and operating parameters such as salty water, moisture, and high temperature. In this study, the effects of aging (storing) the samples at high temperatures on SAC305 alloy were investigated as a function of microstructure characterization. Microstructure morphologies are evaluated regarding the growth of inter-metallic compounds IMCs (Ag3Sn and Cu6Sn5) and grain size. The scanning electron microscope (SEM) and optical microscope were used to analyze the microstructure of Sn grain morphology. Also, to investigate the elemental distribution, energy dispersive spectroscopy (EDS) was used. The results show distinct changes in the microstructure of SAC305 solder alloy due to the aging effect; the quantitative analysis of grain size and intermetallic particle support this result.
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